Irdeto, Twise move forward with CI Plus 2.0 USB CAM
September 14, 2022
Irdeto and Twise have teamed-up to expand the CI Plus 2.0 eco-system currently in place and are bringing a new software solution to the market.
Combining Irdeto Cloaked CA technology and Twise latest CI Plus stack tailored for MT5711 Mediatek chipsets, the new solution has been designed to comply with the highest security requirements including CI Plus ECP based on a secure chipset anchor. This pre-integrated and pre-certified solution enables any manufacturer to produce a USB CAM in a record time.
“We are excited to bring new growth opportunities to the CE manufacturers globally while also offering the more sustainable choice. Cloaked CA helps to eliminate the logistical expenses and complexity associated with smart card distribution. The local manufacturing of USB CAMs further reduces the environmental impact. We are happy to be able to bring this new solution to the market together with Twise,” said Peter Oggel, CTO and SVP of Solutions at Irdeto.
Stéphanie Bizouerne, Twise co-founder, added: “We’ve been cooperating with Irdeto over the last years, and we are proud to achieve this new milestone jointly. The solution paves the way for a CI Plus 2.0 USB CAM deployment in a very near future.”
First products are expected first half of 2023.