EnSilica, a turnkey supplier of mixed signal ASICs and SoCs, has announced it is to supply VITES with a new beamformer chip for satellite user terminals. VITES will use the chip at the heart of its new ViSAT-Ka-band terminal. EnSilica’s beam-forming chip is optimised to enable VITES’s creation of ground-based flat panel user terminals for […]

EnSilica, an ASIC and mixed signal chip maker, has announced a contract to develop a new chip to address the next generation of mass market satellite broadband user terminals. The contract has been awarded through the European Space Agency’s (ESA) Advanced Research in Telecommunications Systems Core Competitiveness programme, through the support of the UK Space […]