Entropic, a world leader in semiconductor solutions for the connected home, has announced its participation on the Advanced Television Roundtable titled ‘HEVC (High-Efficiency Video Codec) and 4K in a Multiscreen World.’ The half-day event in London builds on the excitement and focus on HEVC/4K technologies at the recent IBC 2013 Exhibition earlier this month.
Offering the silicon perspective, Entropic’s Vice President of Sales for Europe, Middle East and India, Noel McKenna, will discuss how HEVC-enabled silicon solutions can improve performance for UltraHD set-top boxes (STB) and other connected home multiscreen devices. The shift to 4K, which allows broadcasters to transmit a signal that is approximately four times the resolution of 1080p, requires new compression technology, such as HEVC, to be included in next-generation STB chipset solutions. With HEVC-enabled chipsets, Pay-TV operators can leverage HEVC’s compression advancements to lower bandwidth demands yet still deliver more content without sacrificing picture quality. Additionally, HEVC-chipsets deliver higher-quality video without adding extra costs associated with the higher bandwidth demands of 4K.
“As we saw at IBC 2013, there is strong global market interest and enthusiasm for 4K, which will require new consumer electronics devices that support high-quality HEVC playback,” said Noel McKenna. “Advanced Television’s panel is timely and presents an opportunity to show how silicon providers, as well as others in the connected home value-chain, can work together to deliver 4K content to Ultra-HD TVs in the home – in both cost- and bandwidth-efficient delivery methods.”
The ‘HEVC and 4K in a Multiscreen World’ panel will be a taped session on Friday, September 27, 2013, and will air online via the Advanced Television website. Panel highlights will also be captured in the January/February 2014 edition of Euromedia, which will be distributed at CSTB Moscow, CabSat Dubai and Cable Congress.